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Bare Chip Mounting Technology
Realizing device modules that are difficult to be achieved with chip technology alone
µFC (micro flip chip) mounting
Device module mounting achieved by fine-pitch printing technology
Micro bump print on the substrate, which uses the fine-pitch printing mask, allows micro flip chip mounting that can be mass-produced by general high-speed mounters. Compared with other bare chip mounting methods, this method has many advantages such as reduced mounting area, easy solder connection, highly-reliable transmission circuit, lower cost, and lighter weight.
µFC method
achieved by solder printing
technique using the plastic mask
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